August 26, 2024Open Access

Unified Model for Predicting the Size and Shape Dependent Cohesive Energy and Melting Temperature of Semiconducting Nanomaterials

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GSGebru Tesfaye SherkaWolkite University HBHabte Dulla BerryWolkite University QZQinfang ZhangFujian Normal University

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Implication

Theoretical model demonstrates size and shape dependent melting temperature in semiconductor nanosolids, highlighting elevated thermal stability in nanowires.

Key Points

Cohesive energy and melting temperature decrease as nanoparticle size drops, with pronounced reductions observed below a diameter of 5 nm.
Nanowires exhibit higher melting temperatures than tetrahedral nanoparticles up to 10 nm, outperforming the universal liquid drop model.
Theoretical model incorporates shape factors and packing density across semiconductor nanosolids, which may guide future nanoscale device design.

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Sherka et al. (2024) studied this question.

synapsesocial.com/papers/68e5aef2b6db643587547fba https://doi.org/10.20944/preprints202408.1795.v1

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Implication

Theoretical model demonstrates size and shape dependent melting temperature in semiconductor nanosolids, highlighting elevated thermal stability in nanowires.

Unified Model for Predicting the Size and Shape Dependent Cohesive Energy and Melting Temperature of Semiconducting Nanomaterials

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Unified Model for Predicting the Size and Shape Dependent Cohesive Energy and Melting Temperature of Semiconducting Nanomaterials

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