Study of selective etching of TaN with respect to SiOCH dielectric using SiF₄ plasma processes

TaN is used as a Cu diffusion barrier during metal interconnect formation to enable modern chip fabrication. In this study, the selective removal of TaN with respect to SiOCH dielectrics is explored using neutral dominant plasmas containing pure SiF 4 or with O 2 or H 2 additives. SiF 4 is studied because the Si-containing gas has been historically used to deposit Si-based films, but the gas also contains F capable of volatilizing Ta. This work explores the possibility of enabling both selective etching of TaN and selective deposition on SiOCH. SiF 4 discharges are impacted by the addition of O 2 and H 2 gases; exhibiting significantly different deposition and etching regimes. The substrate temperature plays a critical role in modulating the TaN etching versus deposition window compared to SiOCH. Through this work, selective etching of TaN with respect to SiOCH is achieved.