Enhanced Cooling of VLSI Circuits Using Heat Sinks Nanofluids

Electronic devices and chips are an integral part of the technological development in all sectors and are helpful to accelerate their growth. Due to the continuous miniaturization and developments of design of VLSI Chip (Very Large-Scale Integration), the amount of heat generation is increasing per unit volume. The increase in thermal issues due to some of the few major reasons such as high electro migration and increasing the junction temperature caused by higher performance, current flow, and compact size. This increased temperature in the electronic chip also affects the other electronic components on its neighbor. This leads to failure in the electronic devices. Consequently, poor reliability significantly reduced lifetime of the semiconductor as well as increased power consumption. Therefore, it has become inevitable to develop efficient heat sinks and heat transfer fluids capable of higher thermal conductivity and heat transfer so as to increase the processing speed of the electronic devices and VLSI Chip.In this work, the new design structure and cooling methods have been proposed based on the few research gaps as mentioned. Three different structure of channel heat sink are designed and analyzed by using CATIA v5, and commercial CFD software (ANSYS FLUENT version12) respectively. The Single-channel heatsink with ordinary water, Al2O3/water as coolants in the Single-channel heat sink at different volume concentration (0.25%, 0.50% and 0.75%)