Significantly enhanced dielectric properties of Ti₃C₂Tx MXene/MoS₂/methylvinyl silicone rubber ternary composites by tuning the particle size of MoS₂

To realize the great potential of silicone rubber in advanced electronics, high dielectric constant and low loss tangent are currently pursued. Adding a third phase to conductive filler/silicone rubber composites may enhance the properties of the composites, but the appropriate particle size of the third phase is an open question. Here, MoS 2 was used as the third phase to prepare the Ti 3 C 2 T x MXene/MoS 2 /methylvinyl silicone rubber (VMQ) ternary composites, and the influence of different sizes of MoS 2 (200 nm and 2 μm) on the dielectric performance of the composites was investigated. The dielectric constant of the Ti 3 C 2 T x MXene/VMQ composites with 5 wt% MoS 2 nanoparticles shows a 279% enhancement from 2.78 to 7.75 at 10 3 Hz, better than that of the Ti 3 C 2 T x MXene‐MoS 2 hybrid fillers/VMQ composites. Compared with micron MoS 2 , nano MoS 2 can significantly enhance the dielectric performance of conductive filler/polymer composites because of shorter interparticle distances and enhanced interfacial polarization. Meanwhile, the composites exhibit low loss tangent (lower than 0.0015) and good thermal stability (up to 400°C) because of the low filling amounts of Ti 3 C 2 T x MXene and MoS 2 nanoparticles. Excellent flexibility with Young's modulus of 285 kPa and elongations break of 446% was also obtained. The design of these ternary composites greatly improves the dielectric and mechanical properties, which means that the dielectric material has a broad application prospect in modern electronics industry. Highlights High dielectric constant was gained in Ti 3 C 2 T x MXene/5n‐MoS 2 /VMQ composites. The MXene/5n‐MoS 2 /VMQ composites exhibited excellent mechanical properties. Appropriate filler size can benefit the performance of polymer composites.