Ultrafast laser drilling of through vias in soda-lime glass using GHz-burst mode operation

In this contribution we show through via drillings in dielectrics by ultrafast laser top-down percussion drilling in GHzburst mode. We point out some limitations that occur during the drilling process and show how to overcome these. Finally, we obtained through vias of almost constant diameter in Sodalime glass, which might be of interest in the microelectronics industry for the fabrication of glass interposers.