Within the Interreg North-West Europe project OIP4NWE, we have set up an open innovation next-generation pilot line for InP-based photonic integrated circuits (PICs) to improve PIC manufacturing and make packaging more reliable and affordable. We present the service offering within the different components of the pilot line, consisting of InP PIC manufacturing in the front-end, and external interfacing optics and packaging in the back-end. We also report on how we supported 6 European SMEs with an innovation support voucher with the OIP4NWE pilot line.
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Erps et al. (2024) studied this question.
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