Advancements in 3D heterogeneously integrated (3DHI) microsystems has the potential to radically change the compute and sensor system design. The dense and intimate integration of multiple chips can dramatically increase the interconnect bandwidth and increase the functionality of sensors and processor chips. The inclusion of integrated photonics in these architectures enables many of these benefits. This talk will share recent DARPA program investments in enabling these architectures. It will also discuss new challenges and opportunities these architectures present for heterogenous integration, photonic integrated circuit and microfabrication manufacturing technology.
No takes yet. Share an insight, caveat, or question.
Anna Tauke-Pedretti (2024) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: