Thermal Computing Traditional electronic computing frequently faces challenges such as elevated power usage, security risks, and vulnerability to harsh environmental factors, including extreme heat and radiation. In article number 2401244, Lei Shao, Jaehyung Ju, and co-workers present a thermal computing approach using several mechanical transistors made from a Kirigami thermomechanical sensor coupled with a bistable actuator that has multi-variable terminals, with potential applications in environments like the International Space Station.
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Chen et al. (2024) studied this question.
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