Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV)

This study investigated the impact of an adhesion layer on Through Glass Via (TGV) samples and studied the creep behavior of copper TGVs. TGV samples with and without an adhesion layer were subjected to thermal cycle. Optical profilometry measured copper via protrusion, while two-dimensional digital image correlation (2D DIC) collected in-plane deformation of the glass substrate near the copper TGV. The results indicated that the adhesion layer reduced plastic deformation in protrusion but increased the maximum displacement in glass. A numerical model, incorporating a time-hardening model for electroplated copper TGV, determined material constants by optimizing experimental and simulation results, showcasing a reverse determination process.