A new Cu paste and negative-type photosensitive adhesive were used to realize Cu–Cu/polymer–polymer hybrid bonding. Cu electrodes (width: 10 μm) formed by chemical mechanical polishing are tightly bonded with an organic dielectric layer. Because of the melting point drop of the Cu nanoparticles originating from the Cu paste printed on the adhesive layer, the bonding temperature was effectively reduced to 200°C.
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Sakamoto et al. (2024) studied this question.
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