Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging

This study involves various routing layouts for chiplet-to-chiplet communication links based on the Bunch of Wires (BoW) standard, which are integrated within the 2.5D package. It encompasses multiple case studies examining single-layer and dual-layer routing configurations for both single and double BoW links. In the context of dual-layer routing, the study explores scenarios where decisions are made on which signal traces should share the same layer for routing. Additionally, it investigates the impact of adding a solid ground plane between the two routing layers. These analyses are particularly relevant given the varied bump pitches inherent in heterogeneous integration applications. The findings from these case studies are systematically presented and compared, with a focus on key eye diagram parameters.