Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

Electrical-thermal co-analysis of high-power 3D integrated circuit (3D-IC) is investigated in this paper. Computational fluid dynamics/heat transfer (CFD/HT) analysis, accounting for thermal resistance and pressure drop, as well as electrical analysis based on local through-silicon via (TSV) density and TSV capacitance, are conducted to provide optimal design solution of TSV-integrated microfluidic pin-fin heat sink for high power dissipation with high bandwidth density in 3D-IC. Depending on the design, up to a 26.1% reduction in thermal resistance, an 84.7% reduction in pressure drop, a 1.3x increase in local TSV density, and a 60.8% reduction in TSV capacitance can be achieved under selective conditions. The intricate trade-off relationship between electrical and thermal characteristics is revealed due to the co-integration of TSVs within micropin-fin heatsinks. We present optimal designs under various weight considerations assigned to electrical and hydro-thermal metrics by exploiting the TOPSIS (Technique for Order Performance by Similarity to Ideal Solution) method.