This paper presents a novel dual/tri-band Antenna-in-Package (AiP) featuring wide bandwidth and dual polarization patterns. The two designs include a 28/38GHz dual-band and a 26/32/37GHz tri-band configuration in Fan-out Wafer Level Packaging (FOWLP) technology. The compact designs measure 6mm×6mm×0.63mm and achieve desirable dual/tri-band bandwidth, Gain, and patterns in Horizontal (H) and Vertical (V) polarizations.
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Mei Sun (2024) studied this question.
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