Direct Deposition of Carbon Films on Tungsten Substrates Using Coaxial Arc Plasma Deposition for Electrochemical Electrode Applications

Carbon films were directly formed on tungsten (W) substrates without an intermediate layer via coaxial arc plasma deposition. The substrate surface was pretreated to remove the native oxide films to improve film adhesion using environmentally friendly alkaline and acidic solutions. The fundamental electrochemical characteristics of the deposited films were similar to those of diamond and diamond‐like carbon films. Thus, the deposited films can be used in the electrodes of highly sensitive electrochemical sensors.