This paper presents an investigation of the thermal characteristics of a baseplate-less 3D printed ceramic power module with integrated liquid cooling for medium voltage SiC MOSFETs. Baseplate-less design eliminates parasitic capacitive couplings which is a limitation in conventional power module packaging. The thermal performance under varying flow conditions is studied using computational fluid dynamics simulation, and experimentally tested using direct chip surface temperature measurements to verify the validity of the proposed ceramic module design approach.
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Jørgensen et al. (2024) studied this question.
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