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This paper investigated the interface quality of electroplated nickel (Ni) and gold (Au) layers processed at different Q-time. This study is important for semiconductor manufacturing processes because Q-time between Ni and Au plating is sometimes inevitable and maintaining good plating quality is essential. It was found that more than 24hours of waiting time between Ni and Au plating did not impact the Ni/Au interface's quality.
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Paul et al. (2024) studied this question.
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