Key points are not available for this paper at this time.
Considering the characteristics of data sensing, noise blocking, and Electromagnetic Interference (EMI) within DRAM, we investigated the method of partitioning power islands in package PCB, through experiments and simulations. When the power of the core die (VDD2APKG) and the power of the interface circuit (VDD2BPKG) were merged, there was little difference in terms of I/O signal transfer characteristics. However, from the EMI perspective, there was an improvement of about 10dB compared to the case with split powers. The simulation results indicate that integrating the core power and IO interface power within the LPDDR4x's PKG PCB is beneficial for reducing EMI. These findings are consistent with experimental results.
Kim et al. (Sun,) studied this question.