Study on Signal Optimization of PCB Design for Wireless Communication

With the progress of high and new technology, the application of new semiconductor materials, semiconductor components such as integrated circuits are developing towards integration and high efficiency. This development trend promotes PCB design towards high density and high efficiency. The current electronic system design generally signal frequency is higher than 100 MHz, the signal in the PCB transmission process is prone to reflection, crosstalk and other signal integrity problems. How to reduce the loss of the signal in the transmission process and ensure the integrity of the signal is the challenge of the development of high frequency high-speed wireless communication PCB. In this paper, some problems needing attention in the signal optimization processing of high density wireless communication PCB design are deeply studied, and the signal optimization processing methods and improvement measures are proposed. Using these designs can effectively reduce the noise caused by stray inductance in PCB, and help to reduce the crosstalk, reflection and electromagnetic interference between signals.