Polymers used in electronic packaging can absorb moisture from the environment and swell, causing serious reliability and assembly issues. However, to this day, moisture swelling properties are not readily available - especially at high temperatures. This paper builds on a novel experimental concept that maintains specimens in a saturated state while measuring high temperature material swelling using digital image correlation (DIC). With this method, different materials such as dielectric build-up films (DBF), epoxy mold compounds (EMC) and solder resist (SR) were evaluated. The resultant hygro-swelling properties were compared against dynamic mechanical analyzer (DMA) measurements and other published data.
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Chin et al. (2024) studied this question.
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