This contribution investigates various Ag pastes for through via interconnect application to produce an integrated horn antenna structure in Low Temperature Cofired Ceramic (L TCC) material. In a two-stage experimental process, the Ag pastes are first limited using a simplified test layout to identify promising pastes for further investigation in the second phase with a more complex design. The electrical contact is verified using the implemented daisy chain. X-ray examinations and cross-sections are performed to assess the quality and quantity of the via fill results.
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Kleinholz et al. (2024) studied this question.
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