A wafer bonder that stably achieves a bonding overlay accuracy of 50 nm is developed. Correction technologies for various bonding-induced distortion fingerprints, which are one of the key technologies, and the prospect for future improvements of bonding overlay accuracy are reported. These high-precision bonding technologies will be essential for the fabrication of future three-dimensional integrated circuits.
No takes yet. Share an insight, caveat, or question.
Mitsuishi et al. (2024) studied this question.
Synapse has enriched 2 closely related papers on similar clinical questions. Consider them for comparative context: