Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects

the purpose of experiment is to understand that the interface strength decay level between PI (Polyimide) and PVD (Physical Vapor Deposited) Cu affected by temperature and humidity coupling environmental conditions. Follow JEDEDC THD (Temperature and Humidity Dwell) test standard, the interface strength decay 86.1% under the combined effects of 85°C and 85% RH after 1000 hours soak time. Temperature on 100°C affect the interface strength to decay by 67.4% after 1000 hours, and humidity on 85%RH affect the interface strength to 41.9 % after 1000 hours. The critical strength deterioration caused by high temperature is particularly significant, especially when the interface peeling phenomenon occurred at a temperature of 200°C after only 250 hours.