We investigates the long-term reliability of a paste fabricated by Cu@Ag particles to prevent the oxidation of Cu. Thermal aging tests were conducted under nitrogen and air atmosphere at high temperature to understand the thermal degradation. After thermal aging, the shear strength of Cu@Ag sintered joint increases in both conditions compared to the initial strength of 34MPa. On cross-sectional analysis, we observed dense microstructure within the Cu@Ag joint in a nitrogen atmosphere, while in air atmosphere, the porous Cu@Ag sinter layer due to the formation of Cu2O was observed. The results are matched well with the tendency of mechanical bonding strength during thermal aging, revealing the thermal stable reliability of Cu@Ag sintering paste.
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Kim et al. (2024) studied this question.
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