Formation of 10 µm Pitch Sharp Micro-Bump by Fusion Process of Imprint and Photolithography

The authors have developed the micro-bump formation technology for the heterogeneous integration innovation, which is a basic technology for the semiconductor packaging of the cutting-edge applications realized by 5G and AI. The authors succeeded in forming the sharp Cu micro-bump with a pitch of 10µm by an original process using imprint, photolithography and plating method. By applying this technology to high-end application devices, it will contribute to cost reduction and performance improvement such as bandwidth expansion and power consumption reduction in the multi-chip packaging.