Influence of Heat Losses on Measurement of Thermal Contact Resistance

In recent years, the thermal management of electronic devices has become important due to the increasing performance and miniaturization of electronic devices. Therefore, accurate thermal contact resistance measurements are necessary for precise thermal design. In this research, CFD (Computational Fluid Dynamics) analysis was performed to evaluate the effect of heat loss in the steady-state thermal contact resistance measurement in two conditions. One condition is insulation material set around the test section, and another condition is without insulation. The effect of heat loss was evaluated by comparing the thermal contact resistance values set in the analysis. The results of the analysis showed that the maximum heat loss from the test section was approximately 6% in the case without insulation. In addition, the error between the analysis results and the thermal contact resistance set in the analysis was less than 2%, indicating that the measurement was accurate even without insulation.