Sintered silver as die attach materials has been increasingly used in power electronic packaging and has attracted much attention. However, the porous structure of sintered may greatly affect the reliability of the power module, the evolution in the microstructure of sintered silver under thermal aging can affect the performance of the interconnects. In the present work, a phase field model is developed to characterize the dynamic evolution of porous sintered silver under isothermal aging. The obtained porous sintered silver structure is then utilised in finite element simulation to analyze the effect of microstructure coarsening caused by thermal aging on thermal and electrical properties.
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Jiang et al. (2024) studied this question.
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