Metal Sinter Material Technology for Power Module Packaging

This study selected nanosilver metal particle fillers with a modified layer residual rate of <0.4 wt%. Research has found that the glycidyl ester resin structure can produce coordination relationships, thereby increasing the diffusion distance of metal particles, improving the sintering series properties of metal particles, and improving the thermal conductivity and wafer shear strength properties of the composition. The formula is dispensed between the silver-plated alumina disc and the silver-plated copper substrate, and a low-temperature pressureless sintering process is performed. The results show that the optimal thermal conductivity value is 120W/m*k, and the shear thrust value of grain shear can reach 80.0MPa at room temperature and 45.0MPa at 260°C. Better than commonly used tin solder products on the market today.