EDA method to address interconnect reliability and reduce overdesign in custom analog designs

A proper simulation of temperature distributions within the electronic design automation (EDA) flows is quite crucial to achieve both a competitive and reliable design in advanced ICs. This work presents an advanced EDA electromigration methodology that accounts for local device self-heating, inter-device thermal coupling and temperature mission profile. By a verification of an analog RF power amplifier design the benefits of our flow and the impact to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Idc</tex> current limit adjustments are demonstrated.