Robust ultrahigh electromagnetic interference shielding effectiveness based on engineered structures of carbon nanotube films

High-performance electromagnetic interference (EMI) shielding materials with ultrathin, flexible, and pliable mechanical properties are highly desired for high-end equipments, yet there remain large challenges in the manufacture of these materials. Here, carbon nanotube film (CNTF)/copper (Cu) nanoparticle (NP) composite films are fabricated via a facile electrodeposition method to achieve high electromagnetic shielding efficiency. Notably, a CNTF/Cu NP composite film with 15 μm thickness can achieve excellent EMI shielding efficiency of ∼248 dB and absolute EMI shielding effectiveness as high as 2.17 × 10