We present a comprehensive investigation into DSA materials and process development for P24 EUV lithography with the objective of mitigating DSA defects and enhancing the smoothness of DSA-defined patterns. We conduct a comparative assessment of the quality of DSA-rectified patterns between PS-b-PMMA and high Chi BCP. Furthermore, we explore resist planforms other than CAR for creating DSA guiding patterns.
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Han et al. (2024) studied this question.
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