Characterization of ionic flux residue in flip chip processes reveals its correlation with reliability performance.
A no clean flux process for flip chip on board was characterized for ionic flux residue and board contamination using a new cleanliness testing system. The benchmarking procedure established a correlation of flux residue to thermal shock reliability. Speciation and quantitation of ionic PWB constituents permitted segregation of incoming board contamination from that caused by the flux. A process window to minimize defects and maximize reliability performance was developed. Methods for performing similar characterization and benchmarking of processes are presented along with the above results.
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Scheifers et al. (1995) studied this question.
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