Power semiconductor devices have seen a rise in the development of wide bandgap (WBG) semiconductors. WBG devices can be bonded at low temperatures due to the transient liquid phase (TLP) bonding process. Applying Cu porous in TLP has been the subject of relevant studies. The strength of metallic joints created by various solders with Cu porous, however, has received less attention in earlier investigations. In this study, the shear strength of metallic joints made of SAC and Sn58Bi is examined. Cu porous was used as an intermediate metal layer, and a 0.2 mm layer of Sn58Bi / SAC solder paste was applied to its top and bottom surfaces. Research has also looked into the impact of bonding time. It can be inferred that the metal junctions formed with SAC solder are stronger and better suited for transient liquid bonding.
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Jiang et al. (2024) studied this question.
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