Investigation of ultra-high-frequency induction-assisted laser wire deposition

This paper introduces a novel approach called ultra-high-frequency (UHF) induction-assisted laser wire deposition. This method utilizes induction heat as an auxiliary source to create a high-temperature zone on the substrate's surface, just ahead of where the metal is deposited. This ensures a strong metallurgical bond between the deposited track and substrate, while the metal wire is also preheated by the induction heat, which helps distribute heat more evenly in the part generated by the high-power laser. To gain insights into the deposition process, we establish a numerical model that combines temperature and electromagnetic fields. Thus, the penetration depth of the deposited track can be predicted through numerical simulation to control dilution rates effectively.