Pin-fin heat sinks are now considered one of the possible solutions for the thermal management of small-scale devices requiring high heat dissipation rates.Pin-fins with fixed diameters, different heights and spacing were numerically investigated in the current study for a range of Re=200-1000.The micro-channel cross-section with pins at the bottom surface measures 55 mm in length and has a cross-sectional area of 1 mm x 1 mm.The fin height ranges from 0.2 to 0.8 mm and the distance between pin-fins ranges from 3-6 mm.The Box-Behknen method was used to determine the number of numerical runs based on the parametric range of pin height and spacing and the Re number.Input data and corresponding outputs were presented using the Genetic Aggregation Response Surface Methodology.An optimum pin height and spacing in terms of heat transfer rates was obtained.It has been observed that at the optimum desing considering the highest Performance Evlauation Criteria(PEC) value the microchannel with pin-fins can provide an enhancement of 364% in heat transfer rates compared to the microchannel without pins, while the corresponding increase in pressure drop reaches up to 162%.
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Gönül et al. (2024) studied this question.
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