54‐2: Sensitivity analysis of Moire phenomena under process window variation

Moire is quite a well‐known phenomenon that can be found in display panels when multiple layouts are overlapped with different pitches. To verify Moire, we applied a step‐wise simulation based on ray‐tracing methodology. First, the CSF contour map was calculated as a function of key design parameters such as the angle and pitch of the metal wire. Then, the sensitivity of Moire image was verified under process variation and viewing angle dependency. A slight change of process variation and viewing angle results in an abrupt change of Moire. CSF value can be increased up to 15 times even a small angle variation such as 0.1 degree