In this paper, based on the OLED display module, this study firstly and systematically carries out the lamination from the material characteristics of SCF, flatness of the lamination interface, aspects of process parameters and so on. The mechanism of the bulge of SCF is revealed by analyzing the micro‐topography of the bulging interface after the reliability test. The results show that the bulge mainly occurs between the EMBO and the BF, and the root cause is that the EMBO is not activated. Further analysis shows that in the process of lamination, the dislocation of the interface occurs due to the force, which leads to the incomplete lamination of the EMBO and the BF, and then micro‐bubbles are generated at the interface, finally the residual micro‐bubbles are expanded by heat, and it causes bulge in the reliability test.
No takes yet. Share an insight, caveat, or question.
Du et al. (2024) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: