66‐1: Progress and Technical Challenges of Trifold Display

The module stack of trifold display was simulated and G‐type trifold modules were prepared. Surface waviness and mechanical properties were tested under room temperature. Cycle folding reliability of both in‐folding and out‐folding was tested simultaneously under room temperature, 60°/90% and ‐20° test environment (RA test). Waviness and reliability improvement of the G‐type trifold display by optimizing test jig, module material and stack. Finally, the failure of module peeling problem during cycle folding test under room temperature was analyzed.