This work studies evolution of copper microstructure during a combined deformation process.The essence of this process is in deformation of copper wire in a rotating equal-channel stepped matrix with subsequent drawing.Deformed wire is examined using transmission electron microscopy and EBSD analysis.After three cycles of deformation, an ultrafine-grained gradient microstructure with a high component of high-angle grain boundaries is obtained.
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Volokitin et al. (2024) studied this question.
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