Experimental analysis demonstrates reduced thermal impact on adjacent ball grid array components during laser rework, indicating improved printed circuit board assembly reliability.
Laser rework and hot air rework process impact on the nearby ball grid array (BGA) rework components with lead-free solder Sn3.0Ag0.5Cu (SAC305) solder joints were investigated in these studies. Reworking BGA components is a challenging procedure with additional implications for printed circuit board assembly (PCBA) reliability due to the thermal exposure affecting the nearby rework components' solder joints qualities. In these studies, we examined thermal exposure effects on nearby BGA rework components and analyzed the solder joint qualities after the rework process by observing the dye penetration percentage along with the separation location on the solder joints. The successful outcomes of the dye and pull (DnP) tests show the laser rework method on BGA components is reliable for high-density PCBA design with up to 15% reduction on the impacted solder joints and 24°C lesser on the peak temperature for the nearby BGA rework components compared to the hot air rework performance.
No takes yet. Share an insight, caveat, or question.
Ismail et al. (2024) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: