Joining thermoplastic polymers (TPMs) and metals to form lightweight hybrid structures is of growing industrial and commercial importance. The performance of such materials relies on the bonding strength and endurance of the formed TPM–metal interfaces. The available joining technologies and the mechanisms that govern interfacial adhesion are reviewed in this contribution, highlighting thermal bonding as a commercially attractive joining method. By focusing on molecular interactions to optimize interfacial adhesion, the use of dopamine as a building block to form polydopamine (PDA) based adhesive interlayers in such interfaces is discussed. This work also highlights the potential of PDA to be applied as a load‐bearing adhesive—a notion considered to date unfeasible.
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Kafkopoulos et al. (2024) studied this question.
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