Nowadays, AI applications is booming developing, and it has had big progress at LLM. HBM, supplying the high-bandwidth and high-speed data solution in device, is supporting it behind the scenes. Compared to traditional DRAM, HBM structure is quite different with 3D-stacked at wafer process. The memory test on HBM is becoming crisscross complicated. To lower the complexity of the test HBM should also some optimized designs. Advantest's T5833, is a key memory tester, which has a full solution on the memory repair. Combined with the ALPG and DBM, it could handle all requirements of HBM test.
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Ling Xiang (2024) studied this question.
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