An Innovative Method and Apparatus for KGSD Testing of 2.5D and 3D Stacked Dies, with Emphasis on High Bandwidth Memory (HBM)

A novel method and associated apparatus tailored for the KGD testing of 2.5D and 3D stacked dies, particularly focusing on High Bandwidth Memory (HBM) have been developed. This is important because the distinctive architecture of HBM necessitates the compression of I/O contacts into a limited, confined space, posing challenges for conventional probing techniques at the die level. To address this issue, we propose a methodology employing vision-based alignment and vacuumpressured chuck, enabling precise positioning of test probes relative to the contact pads of the device under test.