X-FAB's advance 110nm BCD-on-SOI platform technology(XT011) [1] presents two qualified nonvolatile memory intellectual property (NVM IP) macros meeting stringent automotive AEC-Q100 Grade-0 standards. The first IP, XFE, integrates SONOS charge trapping memory for eFlash and EEPROM in a compact macro, boasting a 35.6% size reduction(0.500mm 2 ) compared to its 180nm counterpart(XT018) [2] with equal memory density. The second IP utilizes floating-gate polysilicon storage for a One Time Programmable (OTPF) memory macro. Operating on XT011's low-power 1.5V/5.0V CMOS with Copper BEOL, both IPs demonstrate compliance with automotive and high-temperature environment requirements (-40°C to 175°C), ideal for code and data storage (XFE) and as an optimal trimming solution (OTPF), under harsh operating conditions.
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Jiew et al. (2024) studied this question.
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