Selective Titanium (Ti) etch chemistries have been developed to provide enabling Ti removal up to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.2μ m</tex> thickness with good Cu, Sn-Ag and TEOS compatibility. They are alkaline oxidizing compositions with unique etch promoters. Their applications in Cu RDL and 2.5D/3D integrations have been demonstrated. Etch mechanisms and substrate compatibility are also discussed.
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Chien-Pin Sherman Hsu (2024) studied this question.
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