Photonic glass interposer with integrated optical waveguides for fiber-to-chip coupling

A novel packaging solution is discussed where both optical and electrical connectivity can be fabricated using ion-exchange (IOX) waveguides integrated into a glass with thin film metallization for an electrical redistribution layer. Design and process aspects are discussed to support silicon photonic flip-chip assembly directly to the glass substrate. Low-loss evanescent coupling occurs between the IOX waveguides embedded in the glass and the photonic chips with high-density silicon nitride optical I/Os. This design enables low-cost assembly methods involving the pick and place alignment of optical components and offers connectivity with low-profile mechanical transfer (MT) ferrule-based fiber connectors.