Atomic vapor cells are an important component of many quantum experiments, and MEMS fabrication techniques allow for miniaturization of vapor cells and their associated experiments. Anodic bonding is the most popular technique for this cell fabrication, but it is limited to simple glass-to-silicon bonding interfaces. Here we present fabrication of a MEMS vapor cell using a stack that includes PIC-compatible thin-film borosilicate glass as a bonding surface. We anodically bond a deposited thin film of borosilicate glass to a patterned silicon frame during our fabrication of a MEMS rubidium vapor cell. This technique will allow for wider integration of MEMS vapor cells to photonic integrated circuits.
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Riley et al. (2024) studied this question.
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