Effects of disk size and position on material removal characteristic on double-sided polishing

Using the method of double-sided polishing with oscillating and rotating upper disk, we have investigated the material removal behavior of flat fused silica. It is suggested that the material removal characteristics of the optics depend on the positon and size of the upper polishing disk. Measurements together with the kinematic model results show that the effect of the swing position and size of upper polishing disk similar to sub-aperture polishing, leading to the non-uniformity distribution of the material removal on the surface of the optic component. the surface figure errors of 0.5 wavelengths is achieved after polishing process. The efficiency and quality of double-sided polishing can be improved through changing polishing disk and swing position according to this study.