Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors

This work presents new porous environmental protection caps designed for wafer level chip scale packaging (WLCSP) of MEMS environmental sensors. The caps consist of gaspermeable microstructures formed from loose aluminum oxide powder solidified by a ceramic thin film, grown using atomic layer deposition (ALD). For the first time, the full process flow of the proposed approach is demonstrated by manufacture of the cap wafer followed by substrate bonding using glass-frit technology. By analyzing the influence of the caps on the response time of MEMS humidity sensors, this study proves the viability of the proposed packaging technology. In addition, the ability to further functionalize the porous caps is demonstrated by the deposition of a superhydrophobic polymer thin film by chemical vapor deposition.