Leakage current based Thermal Design Approach for SSD Reliability

Prediction of leakage current and its thermal impact has become critical design challenge in present semiconductor designs. In general, the leakage current is proportional to the device temperatures. With the technology upgrading, the static or leakage current is rising severely, which causes rise in junction temperatures. Present thermal design approaches do not consider the leakage current which is needed to capture thermal effects accurately. This paper explains the impact of leakage power on thermal profile in early design stage for an efficient thermal optimization to reduce peak temperature.