Solder Joint performance of a package is vital and numerous package parameters are critical from reliability perspective like die thickness, mold cap thickness/material, substrate, pad size, ball diameter, solder ball material, mounting type. This paper deals with optimum die positioning to enhance the Solder joint reliability (SJR) performance under temp cycling. Simulation design of experiments (DOEs) were performed to understand the die placement with respect to critical solder ball grid array (BGA). Simulation results depicts there is an improvement in fatigue life when die drifts opposite to the critical BGA. The best performance resulted when the die position was placed at centered position & at lesser offset from center in non-centered die condition. Effect of die thickness and Size/Area were also studied.
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Korpati et al. (2024) studied this question.
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